{"product_id":"diamond-wafer-dicing-machine-portable-glass-silicon-slicer","title":"Diamond Wafer Dicing Machine – Portable Glass \u0026 Silicon Slicer","description":"\n\u003ch2\u003ePrecision Diamond Wafer Dicing \u0026amp; Slicing Machine\u003c\/h2\u003e\n\u003cp\u003eTake your material-cutting workflow to the next level with this \u003cstrong\u003ePortable Diamond Wafer Dicing Machine\u003c\/strong\u003e — a compact, high-precision slicing instrument engineered for cutting silicon wafers, glass substrates, ceramics, and other brittle materials with exceptional accuracy. Whether you're working in a lab, workshop, or electronics fabrication setting, this tool delivers clean, controlled cuts every time.\u003c\/p\u003e\n\n\u003ch3\u003eKey Features\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\n\u003cstrong\u003eDiamond-Grade Cutting:\u003c\/strong\u003e Equipped with a diamond slicing element for superior hardness and longevity, capable of handling silicon wafers, glass, and similar precision materials.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003ePortable \u0026amp; Compact Design:\u003c\/strong\u003e Lightweight and easy to maneuver, making it suitable for bench-top lab use or on-site applications.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eHigh-Precision Slicing:\u003c\/strong\u003e Engineered to deliver consistent, repeatable cuts with minimal material loss — ideal for delicate substrates where accuracy is critical.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eDurable Wood Construction:\u003c\/strong\u003e The instrument housing is crafted from sturdy wood for a stable, vibration-dampening base during operation.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eVersatile Compatibility:\u003c\/strong\u003e Suitable for silicon wafers, glass panels, ceramic tiles, and other brittle flat materials commonly used in electronics and research.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eUser-Friendly Operation:\u003c\/strong\u003e Intuitive mechanical design allows both experienced technicians and newcomers to achieve professional results quickly.\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eIdeal Applications\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003eSilicon wafer dicing for semiconductor and electronics R\u0026amp;D\u003c\/li\u003e\n  \u003cli\u003eGlass substrate slicing for optical and display applications\u003c\/li\u003e\n  \u003cli\u003eLaboratory sample preparation and material sectioning\u003c\/li\u003e\n  \u003cli\u003ePrototype fabrication and small-batch component cutting\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eSpecifications\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\n\u003cstrong\u003eMaterial:\u003c\/strong\u003e Wood (housing\/frame)\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eCutting Element:\u003c\/strong\u003e Diamond\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eApplication:\u003c\/strong\u003e Silicon wafer, glass, and brittle material dicing\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eDesign:\u003c\/strong\u003e Portable \/ Benchtop\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eCountry of Origin:\u003c\/strong\u003e Made in China\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eRelated Products You May Like\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\u003ca href=\"\/products\/hex-shank-wire-twister-drill-attachment-rebar-tie-wire-tool\"\u003e1\/4\" Hex Wire Twister Drill Attachment – Rebar Tie Wire Tool\u003c\/a\u003e\u003c\/li\u003e\n  \u003cli\u003e\u003ca href=\"\/products\/1-4-3-8-to-m4-m5-m6-m8-m10-thread-conversion-screw-mount-adapter-tripod-projector\"\u003e1\/4\" \u0026amp; 3\/8\" to M4–M10 Thread Conversion Screw Mount Adapter\u003c\/a\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003cp\u003eFor more information on safe tool handling practices in laboratory and workshop environments, refer to OSHA's Tools \u0026amp; Equipment Safety Guidelines.\u003c\/p\u003e\n\n\u003cp\u003eLearn more: \u003ca href=\"https:\/\/en.wikipedia.org\/wiki\/Machine_tool\" target=\"_blank\" rel=\"noopener\"\u003eMachine tool\u003c\/a\u003e\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003ch4\u003eQ: What materials can this diamond wafer dicing machine cut?\u003c\/h4\u003e\n\u003cp\u003eA: This portable diamond slicing instrument is designed primarily for silicon wafers and glass substrates, but can also handle other brittle flat materials such as ceramics and similar precision components commonly used in electronics and research environments.\u003c\/p\u003e\n\n\u003ch4\u003eQ: Is this dicing machine suitable for laboratory or home workshop use?\u003c\/h4\u003e\n\u003cp\u003eA: Yes. Its compact, portable design makes it well-suited for benchtop laboratory use, electronics R\u0026amp;D environments, and small-scale workshop applications where precision slicing of delicate materials is required.\u003c\/p\u003e\n\n\u003ch4\u003eQ: How does the diamond cutting element work?\u003c\/h4\u003e\n\u003cp\u003eA: The diamond-tipped slicing element leverages the extreme hardness of diamond particles to score and cut through hard, brittle materials with minimal chipping or material loss, delivering clean, accurate cuts across silicon wafers, glass, and similar substrates.\u003c\/p\u003e\n\n\u003ch4\u003eQ: What is the housing of the machine made from?\u003c\/h4\u003e\n\u003cp\u003eA: The frame and housing of this slicing instrument are constructed from wood, which provides a stable and vibration-dampening base to support consistent, precise cutting performance.\u003c\/p\u003e\n\n\u003cscript type=\"application\/ld+json\"\u003e{\"@context\": \"https:\/\/schema.org\", \"@type\": \"FAQPage\", \"mainEntity\": [{\"@type\": \"Question\", \"name\": \"What materials can this diamond wafer dicing machine cut?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"This portable diamond slicing instrument is designed primarily for silicon wafers and glass substrates, but can also handle other brittle flat materials such as ceramics and similar precision components commonly used in electronics and research environments.\"}}, {\"@type\": \"Question\", \"name\": \"Is this dicing machine suitable for laboratory or home workshop use?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"Yes. Its compact, portable design makes it well-suited for benchtop laboratory use, electronics R\u0026D environments, and small-scale workshop applications where precision slicing of delicate materials is required.\"}}, {\"@type\": \"Question\", \"name\": \"How does the diamond cutting element work?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"The diamond-tipped slicing element leverages the extreme hardness of diamond particles to score and cut through hard, brittle materials with minimal chipping or material loss, delivering clean, accurate cuts across silicon wafers, glass, and similar substrates.\"}}, {\"@type\": \"Question\", \"name\": \"What is the housing of the machine made from?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"The frame and housing of this slicing instrument are constructed from wood, which provides a stable and vibration-dampening base to support consistent, precise cutting performance.\"}}]}\u003c\/script\u003e\n\u003cscript type=\"application\/ld+json\"\u003e{\"@context\": \"https:\/\/schema.org\", \"@type\": \"BreadcrumbList\", \"itemListElement\": [{\"@type\": \"ListItem\", \"position\": 1, \"name\": \"Home\", \"item\": \"https:\/\/oasis-select.com\/\"}, {\"@type\": \"ListItem\", \"position\": 2, \"name\": \"Sewing \u0026 Hand Tools\", \"item\": \"https:\/\/oasis-select.com\/collections\/sewing-hand-tools\"}, {\"@type\": \"ListItem\", \"position\": 3, \"name\": \"Diamond Wafer Dicing Machine – Portable Glass \u0026 Silicon Slicer\", \"item\": \"https:\/\/oasis-select.com\/products\/diamond-wafer-dicing-machine-portable-glass-silicon-slicer\"}]}\u003c\/script\u003e","brand":"Oasis Select","offers":[{"title":"Alloy Segment","offer_id":47745057063017,"sku":"14:29#Alloy Segment","price":638.31,"currency_code":"USD","in_stock":true},{"title":"Diamond joint","offer_id":47745057095785,"sku":"14:366#Diamond joint","price":638.31,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0679\/7931\/3257\/files\/S30e41a9349f046ca825b4bcad2b123978.webp?v=1783030270","url":"https:\/\/oasis-select.com\/products\/diamond-wafer-dicing-machine-portable-glass-silicon-slicer","provider":"Oasis Select","version":"1.0","type":"link"}