PTM7950 Phase Change Thermal Pad 8.5 W/mK – CPU & GPU

PTM7950 Phase Change Thermal Pad – Ultimate CPU & GPU Cooling Solution

Keep your laptop or desktop running cool and at peak performance with this high-performance PTM7950 Phase Change Thermal Pad. Engineered with ultra-high thermal conductivity of 8.5 W/mK, this 0.25mm silicone pad is designed as a direct replacement or upgrade for CPU and GPU thermal interface materials, dramatically reducing heat buildup and protecting your components.

Made in Mainland China.

Why Choose the PTM7950 Thermal Pad?

• Exceptional Thermal Conductivity: 8.5 W/mK rating and ultra-low thermal impedance of just 0.04 °C·cm²/W ensure rapid, efficient heat transfer from your CPU or GPU to the heat sink.
• Phase Change Technology: Transitions from solid to semi-liquid state at temperatures below 45°C, conforming perfectly to micro-surface irregularities for virtually zero contact resistance — far superior to traditional thermal paste.
• Proven Reliability: Passes rigorous testing including 1,000 hours at 150°C baking and 1,000 thermal cycles (T/C-B), making it ideal for high-performance integrated circuits and demanding workloads.
• Ultra-Thin Profile: At just 0.25mm thick, it maintains an extremely thin bond line (under 0.038mm under optimal clamping pressure), minimizing thermal resistance between chip and cooler.
• Easy to Apply: Comes with easy-tear adhesive aids for clean, frustration-free installation. No mess, no pump-out, no re-application needed.
• Versatile Sizing: Available in five sizes — 31×40mm, 40×40mm, 40×80mm, 80×80mm, and 80×160mm — to fit a wide range of CPUs, GPUs, graphics cards, laptop chips, and custom heat dissipation modules.
• Premium Silicone Material: High-quality silicone construction is soft, flexible, and features a smooth, precision-finished surface for maximum contact coverage.

Full Specifications

Compatible With

Designed for use with CPUs, GPUs, graphics cards, laptop processors, desktop chips, power supply modules, computer hosts, and any custom heat dissipation module that requires reliable, high-performance thermal interface material.

How to Apply Your PTM7950 Thermal Pad

1. Clean the surfaces: Thoroughly clean the chip surface and the heat sink contact surface using an alcohol wipe to remove all old thermal material and debris.
2. Cut to size: Trim the pad to match your chip size exactly. When applying to the chip surface, cut the pad to the same size or slightly smaller than the chip with clean, solid edges. When applying to the heat sink base, cut the pad slightly larger than the chip for easier alignment.
3. Peel and apply (first side): Tear off one side of the release film and adhere the pad to either the chip surface or heat sink base. If the pad is too warm and soft, refrigerate briefly for 5–10 minutes to firm it up before peeling.
4. Press firmly: Apply even thumb pressure across the entire pad surface to ensure full adhesion and eliminate air gaps.
5. Peel second side: Remove the remaining release film. Use the included easy-tear adhesive aids, starting from a corner, for a clean peel.
6. Install your cooler: Mount and fasten the heat sink immediately, then power on your system. The pad will activate during normal operation.

⚠️ Important Note: This is a phase change material. Minor edge deformation may occur during air transport due to cabin pressure and temperature changes — this does not affect performance. Please do not purchase if this is not acceptable.

Learn More About Thermal Management

For more information on electronics thermal management best practices, visit the U.S. Department of Energy – Thermal Management Resources. You can also reference NIST Thermal Metrology standards for technical guidance on thermal conductivity measurement.

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Frequently Asked Questions

Q: What is a phase change thermal pad and how does the PTM7950 work?

A: A phase change thermal pad is a thermal interface material (TIM) that transitions from a solid to a semi-liquid state at a set temperature — in this case, below 45°C. As the CPU or GPU heats up during operation, the PTM7950 pad softens and flows into microscopic surface irregularities on both the chip and heat sink, maximizing contact area and reducing thermal resistance. This results in significantly better heat transfer than traditional dry pads or even some thermal pastes.

Q: Is the PTM7950 thermal pad reusable or a one-time application?

A: The PTM7950 is generally designed as a single-use, semi-permanent application. Once installed and cycled through operating temperatures, it conforms to the mating surfaces. It can technically be removed and reapplied if necessary (e.g., during cooler maintenance), but best performance is achieved with a fresh pad on clean surfaces for each major installation. Always clean both surfaces with isopropyl alcohol before reapplying.

Q: Which size PTM7950 thermal pad should I choose for my laptop or desktop CPU?

A: For most laptop CPUs and smaller mobile GPUs, the 31×40mm or 40×40mm sizes are ideal. For desktop CPUs and larger GPU dies, the 40×80mm or 80×80mm options offer full coverage. The 80×160mm sheet is best suited for larger heat spreader surfaces or custom cooling setups. Always measure your chip die size before ordering and cut the pad to match or slightly smaller than the chip for optimal results.

Q: How does the PTM7950 compare to regular thermal paste?

A: The PTM7950 offers several advantages over traditional thermal paste. It delivers a more consistent, uniform bond line thickness (as thin as 0.038mm), has no risk of pump-out over time, leaves no residue, and is far cleaner to handle. Its 8.5 W/mK thermal conductivity and 0.04 °C·cm²/W thermal impedance put it among the top-performing thermal interface materials available for consumer electronics.